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半导体桥的研究进展与发展趋势(
)
《爆破器材》[ISSN:1001-8352/CN:32-1163/TJ]
- 卷:
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38
- 期数:
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2009年02
- 页码:
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21-24
- 栏目:
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爆破技术
- 出版日期:
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2009-04-20
文章信息/Info
- Title:
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Progress and Development on Semiconductor Bridge Initiator
- 文章编号:
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4135
- 作者:
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张文超; 张伟; 徐振相; 秦志春; 周彬; 叶家海; 田桂蓉
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（南京理工大学化工学院，江苏南京210094）
- Author(s):
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ZHANG Wenchao; ZHANG Wei; XU Zhenxiang; QIN Zhichun; ZHOU Bin; YE Jiahai; TIAN Guirong
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School of Chemical Engineering， Nanjing University of Science & Technology (Jiangsu Nanjing， 210094)
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- 关键词:
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- Keywords:
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- 分类号:
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TJ450.3 TD235.22
- 文献标志码:
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A
- 摘要:
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文章系统地综述了半导体桥芯片的研究现状和半导体桥点火性能测试的研究进展，并对半导体桥的发展趋势以及应用前景进行了分析和展望，指出今后应当对反应式半导体桥和其它新型半导体桥的设计、制备及点火机理进行研究。
- Abstract:
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The progresses of semiconductor bridge chip and its ignition characteristic measurement have been summarized systematically. The development trend and applied prospect have been analyzed for the semiconductor bridge chip. It is pointed out that design， manufacture and firing mechanism of the reactive SCB and the other composite SCB should be investigated in the future.
更新日期/Last Update:
2011-05-24