[1]赵娟,徐洪涛,封雪松.黏结剂相对分子质量对浇注PBX固化应力的影响[J].爆破器材,2016,45(02):6-10.[doi:10.3969/j.issn.1001-8352.2016.02.002]
　ZHAO Juan,XU Hongtao,FENG Xuesong.Effects of Binder with Different Relative Molecular Mass on Curing Stresses of Casting Polymer Bonded Explosives[J].EXPLOSIVE MATERIALS,2016,45(02):6-10.[doi:10.3969/j.issn.1001-8352.2016.02.002]
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黏结剂相对分子质量对浇注PBX固化应力的影响()
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《爆破器材》[ISSN:1001-8352/CN:32-1163/TJ]

卷:
45
期数:
2016年02
页码:
6-10
栏目:
基础理论
出版日期:
2016-03-27

文章信息/Info

Title:
Effects of Binder with Different Relative Molecular Mass on Curing Stresses of Casting Polymer Bonded Explosives
文章编号:
4979
作者:
赵娟; 徐洪涛; 封雪松
西安近代化学研究所（陕西西安，710065）
Author(s):
ZHAO Juan;  XU Hongtao;  FENG Xuesong 
Xi’an Modern Chemistry Research Institute (Shaanxi Xi’an, 710065)
关键词:
浇注PBX; 固化应力; 黏结剂相对分子质量; 黏结强度
Keywords:
casting polymer bonded explosives;  curing stress;  relative molecular mass of binder;  binding strength
分类号:
TQ56;O63
DOI:
10.3969/j.issn.1001-8352.2016.02.002
文献标志码:
A
摘要:
采用自行研制的固化应力测试装置，测量了端羟基聚丁二烯（HTPB）基浇注高聚物黏结炸药（PBX）固化过程的应力变化，计算出固化应力数据，分析了黏结剂相对分子质量对热固性浇注PBX固化应力的影响，并对其在不同固化温度下的黏结强度进行了测试。结果表明：同一固化温度时，随着HTPB相对分子质量的逐渐增大，浇注PBX在固化阶段的最大热应力及收缩应力都逐渐减小。固化温度为100 ℃时，相对分子质量为1 500、2 800、4 000的HTPB基固化物因固化反应所产生的最大热应力分别为2.14、1.12、1.01 MPa，最大收缩应力分别为0.29、0.22、0.15 MPa。在固化降温阶段，HTPB相对分子质量越大，浇注PBX的收缩应力也越大。HTPB相对分子质量相同时，固化物的黏结强度随着固化温度的升高而降低；而固化温度一定时，HTPB相对分子质量对浇注PBX的黏结强度影响不大。
Abstract:
The strain change in the curing process of casting polymer bonded explosives (PBX) containing HTPB was measured by a self-designed device and method. The curing stresses of casting PBX were calculated and the effect of binder with different relative molecular mass on the curing stresses of casting PBX was studied. The bonding strength of casting PBX under different solidification temperature was also tested. Results show that the maximum curing stresses and the shrinkage stresses of PBX decrease with the increasing of relative molecular mass of HTPB under the same curing temperature at isothermal curing stage. When the relative molecular mass of HTPB are 1 500, 2 800, 4 000 and the solidification temperature is 100℃, the maximum curing stresses of PBX are 2.14, 1.12, and 1.01 MPa, and the shrinkage stresses of PBX are 0.29, 0.22, and 0.15 MPa. At cooling stage, the shrinkage stresses of PBX increases with an increase in relative molecular mass of HTPB. For the PBX with same relative molecular mass of HTPB, the binding strength decreases with the increase of solidification temperature, while the relative molecular mass of HTPB has little effect on the binding strength of PBX.

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备注/Memo

备注/Memo:
收稿日期：2015-05-28
基金项目：国防973 资助项目(51340030101)
作者简介：赵娟（1988~ ），女，硕士，研究方向为炸药性能及爆轰化学反应研究。E-mail: canghaiyisu_zj@126.com
更新日期/Last Update: 2016-03-25